initial prep depth
0.5mm past DEJ
basic mechanism for adhesion
MECHANICAL!!!!
exchange process (minerals or resin monomers)
higher SE: enamel or dentin?
enamel
etch pore depth
5-50 microns
etch effect
micropores
^ SE
^ wettability
contact angles
high: low SE, beading, bad
low: high SE, spreading, good
good bond strength measurement
20+ MPa
enamel bonding agent
low viscosity monomers (Bis-GMA)
more min: peri or intertubular dentin
peri
causes of dentin variability (4)
depth
sclerotic
reparative
hypermin
smear layer reduces dentin perm by _______
86%
smear layer bond strength
2-3MPa
5th gen
etch
primer + adhesive
(technique sensitive)
6th gen
NO RINSE
etch + primer
adhesive
(decent)
&
all-in-on
(bad)
4th gen product
optibond FL
5th gen product
optibond SOLO
7th gen
NO MIX
all-in-one
all-in-one draw backs
multiple layers
etch percentage
37% phosphoric acid
primer's chemical effect
hydrophillic --> hydrophobic
diplaces h20, infiltrates collagen
enamel adhesive
adhesive resin (bis-GMA) - unfilled monomers
stabilizes hybrid layer, creates resin tags
what will happen if dentin is over dried after etch?
poor bond
leakage
two types of RMGI bonding
mechanical
chemical
RMGI bond product
Fujibond LC