OPER enamel and dentin bonding

initial prep depth

0.5mm past DEJ

basic mechanism for adhesion

MECHANICAL!!!!
exchange process (minerals or resin monomers)

higher SE: enamel or dentin?

enamel

etch pore depth

5-50 microns

etch effect

micropores
^ SE
^ wettability

contact angles

high: low SE, beading, bad
low: high SE, spreading, good

good bond strength measurement

20+ MPa

enamel bonding agent

low viscosity monomers (Bis-GMA)

more min: peri or intertubular dentin

peri

causes of dentin variability (4)

depth
sclerotic
reparative
hypermin

smear layer reduces dentin perm by _______

86%

smear layer bond strength

2-3MPa

5th gen

etch
primer + adhesive
(technique sensitive)

6th gen

NO RINSE
etch + primer
adhesive
(decent)
&
all-in-on
(bad)

4th gen product

optibond FL

5th gen product

optibond SOLO

7th gen

NO MIX
all-in-one

all-in-one draw backs

multiple layers

etch percentage

37% phosphoric acid

primer's chemical effect

hydrophillic --> hydrophobic
diplaces h20, infiltrates collagen

enamel adhesive

adhesive resin (bis-GMA) - unfilled monomers
stabilizes hybrid layer, creates resin tags

what will happen if dentin is over dried after etch?

poor bond
leakage

two types of RMGI bonding

mechanical
chemical

RMGI bond product

Fujibond LC